While most of our processing is performed at the die level, we have developed a process for hybridizing and back processing 150 mm wafers.  CCD wafers are hybridized to aluminum nitride ceramic substrates with indium bumps and laser drilled vias and then thinned as a complete wafer.  Backside coating and dicing follow, yielding fully buttable backside devices which are no larger than the original CCD die.  This represents a true 4-side buttable technology.