A wafer dicing saw is needed to cut (or dice) the individual detectors from the round wafers on which they are fabricated.  We also dice the flip chip bonding substrates produced on silicon wafers.

We have a Kulicke and Soffa saw (see right) for dicing wafers up to 6-inches in diameter.  The saw has automation capabilities and can be used to dice a number of materials, including silicon, glass, and ceramics.  It has been fitted with a custom high-conductance water-feed system which reduces static charge build-up during dicing which can lead to Electrostatic Discharge (ESD) failure of the sensitive detectors. 

Close-up view of the saw chuck and blade.