Packaging of our back illuminated CCDs is accomplished by mounting the thinned CCD with its substrate to a metal package.  We have designed each silicon substrate to fit into a particular Kovar or Invar package.  Each electrical trace on the substrate leads from an indium bump to a wire bonding pad. Commercial Kovar packages are not flat enough for the large area CCDs require in spectrographs and for wide field mosaics.  By replacing all these packages with custom Invar carriers, we will routinely achieve flat and stable imaging surfaces as well as provide a much simpler I/O connection in the dewar.

Standard thermo compression gold ball bonding is used to wire bond (above and left) from the pad to an I/O pin.  To check the reliability of our wire bonds, we pull test each to the required MIL-STD specification (below).

Below is a fully packaged back-illuminated 1200x800 CCD.