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technologies [2018/12/20 20:48]
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technologies [2018/12/20 20:50] (current)
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 We also have a fully automated stud bumping machine which applies bumps at the wafer level. ​ We use flip chip bonding machines to align the device with the substrate and apply the necessary heat and pressure. We have four bonders capable of bonding devices larger than 6" including detectors, wafers, and substrates. We also have a fully automated stud bumping machine which applies bumps at the wafer level. ​ We use flip chip bonding machines to align the device with the substrate and apply the necessary heat and pressure. We have four bonders capable of bonding devices larger than 6" including detectors, wafers, and substrates.
  
-<​WRAP>​ 
 {{ :​studbumper.jpg|Stud bumping machine}} {{ :​studbumper.jpg|Stud bumping machine}}
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 A very important goal of our CCD optimization has been to produce a flat and stable imaging surface . Our target flatness is to maintain the imaging surface to within <10 microns of a plane, peak-to-valley. The flip chip process allows this flatness to be maintained because the CCD is forced against a custom silicon support substrate. Profilometry of thinned CCDs show we can meet this flatness specification as well as exceed it when required. A very important goal of our CCD optimization has been to produce a flat and stable imaging surface . Our target flatness is to maintain the imaging surface to within <10 microns of a plane, peak-to-valley. The flip chip process allows this flatness to be maintained because the CCD is forced against a custom silicon support substrate. Profilometry of thinned CCDs show we can meet this flatness specification as well as exceed it when required.
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 {{:​hybridize.jpg|Flip chip bonder or hybridizer}} {{:​hybridize.jpg|Flip chip bonder or hybridizer}}
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 ===Backside Etching=== ===Backside Etching===